The defect is half a millimetre.
The board is three hundred.
AI inspection for electronics manufacturing — component presence, placement, solder condition and marking, at the resolution the defect actually requires.
Test it on your productThe Hard Case
Everything in electronics inspection
is a resolution argument.
The governing constraint is simple and unforgiving: the defect you need to see sets the resolution, the resolution sets the field of view, and the field of view sets how many inspection points you need to cover the board.
Get that arithmetic wrong at specification time and no amount of model quality recovers it. A system that cannot resolve the defect will never detect it reliably, regardless of how it is trained.
The second difficulty is that solder is specular and boards are dense. A joint that looks acceptable from one angle looks suspect from another, and a rule written for one component package does not transfer to the next.
Resolution is settled before anything is trained.
We work back from your smallest defect to the camera, lens and working distance, so the imaging is capable of the job before a model is built on top of it.
Several checks, one inspection point.
Presence, placement, polarity and marking run simultaneously on the same board image rather than requiring separate passes.
What it checks
The checks an electronics line
actually needs.
Is everything populated?
Component presence
Presence and absence of components across the board, including small passives.
Is it in the right place?
Placement & alignment
Position, rotation and offset against the expected placement for that reference.
Is it the right way round?
Polarity & orientation
Polarity marking and orientation on diodes, electrolytics, ICs and connectors.
Does the joint look right?
Solder condition
Visual joint appearance — insufficient, excess, bridging and disturbed joints on visible solder.
Is this the right component?
Marking & part ID
Component marking read and checked against the expected part for that position.
Is the board itself sound?
Board-level defects
Damage, contamination, residue and handling marks on the bare or populated board.
Are the pins sound?
Connector & pin
Bent, missing or misaligned pins and connector seating before assembly.
Is it labelled and traceable?
Label & serial
Label presence, position and serial or data matrix reading for unit traceability.
Is the enclosure complete?
Final assembly
Component presence, cable routing, fastener presence and closure at box-build level.
Built for the environment
Fine features, reflective joints,
static-controlled areas.
Electronics is less mechanically hostile than metalworking but far less forgiving on imaging. These are the conditions the hardware is specified against.
ENVIRONMENT
Built for stability. Designed for real-world conditions.
- ESD controlMounting and hardware appropriate to a static-controlled area
- ResolutionCamera and lens selected from your smallest defect, not from a catalogue default
- Working distanceOptics specified against available space above the conveyor or fixture
- Cycle timeInspection specified to fit within the cell cycle, not extend it
- CleanlinessSealed optics with a defined cleaning interval for flux and dust
IMAGING
Clearer vision. Smarter inspection.
- Small featuresHigh-resolution industrial cameras matched to defect size
- Specular solderMulti-angle and dome lighting for joint appearance
- Height and coplanarity3D sensing where standoff and seating matter
- Marking and codesOCR, OCV and code reading on marked parts
- Large boardsMultiple inspection points where one field of view cannot cover the board
- Low contrastLighting selected for dark components on dark substrate
On lighting. Solder is one of the most difficult surfaces in industrial vision: it is specular, curved and surrounded by components that cast shadows. Multi-angle and dome illumination is specified per board and validated on real assemblies, including the densest areas.
Where the record matters
Build records outlive the build.
Electronics defects frequently surface in the field rather than on the line, which makes what you retained at build time the only evidence available later.
Unit-level build record
Every board or unit inspected is logged with its result and an image reference, so a field failure can be traced back to how that specific unit looked when it was built.
Consistent acceptance
Acceptability criteria for electronics assemblies are widely standardised, but their application by eye varies between inspectors. A trained model applies the same interpretation to every board.
Trend visibility
Placement drift, a failing nozzle or a degrading printhead shows as a trend across boards long before it shows as a failure on one.
The Platform
One Place to Train.
Two Place to Run
Shared by both
Model development
Models
Quality
Line 1
Line 2
Line 3
Results
Every line, plant and country
Safety
Production floor
existing cameras
Warehouse
existing cameras
Loading bay
existing cameras
Streams
Runtime and dashboard in one
Standards & codes
The standards your boards
are judged against.
The published criteria your customers, auditors and quality team already reference. We train models against your interpretation of these standards — we do not certify conformance to them, and an inspection result is not a conformity assessment.
IPC-A-610
What it covers
Acceptability of Electronic Assemblies. Visual acceptance criteria for soldered assemblies covering solder joints, component mounting, cleanliness and coating, applied at Class 1, 2 or 3 depending on the product.
Where it applies
Solder condition, component presence, placement and orientation
IPC J-STD-001
What it covers
Requirements for Soldered Electrical and Electronic Assemblies. Materials, methods and process requirements for producing acceptable soldered connections, weighted towards process control rather than end-product inspection alone.
Where it applies
The process-side criteria behind the joints being inspected
ISO/IEC 15415
What it covers
Print quality for 2D codes. Graded A to F on symbol contrast, modulation, fixed pattern damage and grid non-uniformity, with the lowest parameter grade setting the overall grade.
Where it applies
Data matrix verification on boards and labels
ISO/IEC TR 29158
What it covers
Direct part mark quality, the DPM variant of 15415. Adds 30, 45 and 90 degree and dome lighting for curved, reflective and dot-peened surfaces.
Where it applies
Marked components, boards and enclosures
Automotive questions
What electronics teams ask first.
That is settled before anything else. We work back from your smallest defect to the required resolution, then to the camera, lens and working distance, and confirm the imaging is capable during the feasibility assessment — before a model is built on top of it.
Still deciding
The one question this page can't answer:
does it work on your defect?
Start here
Send us your images
Share examples of the defect you care about. We train a model on your product and come back with a straight answer — including if it's no.
Start a feasibility checkOr ask directly
Talk to an engineer
Thirty minutes with someone who builds this. Bring your line speed, your defects and your integration constraints.